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2. º»ÀÎÀº ¼±ÀÎÀüÀÚ ¿µ¾÷ÆÀÀå ÀÌÇØÁØ°úÀåÀÔ´Ï´Ù. Æä»ç´Â °æ±âµµ ½ÃÈï½Ã ½ÃÈ°ø´Ü 1³ª 509¿¡ ¼ÒÀçÇÑ PCB Àü¹®¾÷üÀÔ´Ï´Ù, FPC, ÀϹÝB/D, Impedance ControlledB/D, Back PlaneB/D, High DensityB/D, IVH B/D Á¦ÀÛ °¡´ÉÇÑ È¸»çÀÔ´Ï´Ù. TEL:031-319-2695 FAX :031-434-6067 HP :017-243-9576 e-mail: amc2005@chol.com
Impedance ControlledB/D -Specification Specification (Unit : mm) (Unit : inch)
Layer 14-40 14-40 Base material FR-4 FR-4 Thickness 4.8-6.5 0.19 - 0.256 Conductor width 0.15 0.006 Conductor space 0.15 0.006 Hole diameter ©ª 0.4 0.016 Surface treatment Electroless gold plating ¡ç
Back PlaneB/D -Specification Specification (Unit : mm) (Unit : inch)
Layer 4-12 (40) 4-12 (40) Base material FR-4 FR-4 Thickness 1.0-1.6 0.04 - 0.062 Conductor width 0.1 0.004 Conductor space 0.1 0.004 Hole diameter ©ª 0.2 0.008 Surface treatment Electroless gold plating & HASL ¡ç
High DensityB/D -Specification Specification (Unit : mm) (Unit : inch) Layer 4-16 4-16 Base material FR-4 FR-4 Thickness 3.2 0.126 Conductor width 0.15 0.006 Conductor space 0.15 0.006 Hole diameter ©ª 0.4 0.016 Surface treatment Electroless gold plating & HASL ¡ç
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